| PART |
Description |
Maker |
| DFN1006-2 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| DFN1006H4-2 AP02002 DFN0603H3-2 DFN1006-2 DFN1006- |
PACKAGE OUTLINE DIMENSIONS
|
Diodes Incorporated
|
| AP02002 |
PACKAGE OUTLINE DIMENSIONS
|
Diodes Incorporated
|
| TO-247ACPACKAGE |
Case Outline and Dimensions
|
International Rectifier
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| SSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|
| TO220 |
Package Outline
|
Global Mixed-mode Techn...
|
| TO220F |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT109-1 |
Package outline
|
NXP Semiconductors
Philips Semiconductors
|
